štvrtok, 7 decembra, 2023
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Avicena companions with ams OSRAM to allow high-volume future manufacturing of ultra-low vitality chip-to-chip interconnects

Avicena has signed a joint growth settlement with ams OSRAM to develop key high-volume manufacturing capabilities for its LightBundle optical interconnects.

San Diego, CA — March 6, 2023 — AvicenaTech Corp., a privately held firm in Sunnyvale, CA, has partnered with ams OSRAM to develop high-volume manufacturing of GaN microLED arrays for its industry-leading LightBundle™ communication structure. The necessity for subsequent technology computing energy is right here, pushed by robust AI/ML and HPC utility demand – for merchandise like ChatGPT, DALL-E, autonomous car coaching, and lots of others. Makes an attempt to scale present architectures are working headlong into bodily limits resulting in slower throughput development, power-hungry and arduous to chill methods. The Avicena LightBundle structure breaks new floor by unlocking the efficiency of xPUs, reminiscence and sensors – eradicating key constraints of bandwidth and proximity whereas concurrently providing an order-of-magnitude discount in energy consumption.

“We acquired our fab from Nanosys in October to speed up our growth efforts and help low-volume prototype manufacturing,” says Bardia Pezeshki, founder and CEO of Avicena. “Nonetheless, we’re addressing very sizeable markets requiring high-volume manufacturing. We’re very happy to associate with certainly one of world’s high GaN LED corporations to offer a path to fulfill the anticipated excessive volumes required by our prospects, together with hyperscale datacenter operators and the world’s main IC corporations.”

“Avicena’s LightBundle expertise gives a possibility for GaN microLEDs to influence quite a few key functions together with HPC, AI/ML, sensors, automotive and aerospace,” says Robert Feurle, Government Vice President and Managing Director, OS Enterprise Unit at ams OSRAM. “As a world chief in GaN LEDs, we’re excited to associate with Avicena to remodel these very massive and necessary markets.”

Concerning the Know-how

Right now’s high-performance ICs use SerDes-based electrical hyperlinks to realize enough IO density. Nonetheless, the facility consumption and bandwidth density of those electrical hyperlinks degrade rapidly with size. Typical optical communications applied sciences developed for networking functions have been impractical for inter-processor and processor-memory interconnects as a result of their low bandwidth density, excessive energy consumption, and excessive price. Furthermore, co-packaging current laser sources with sizzling ASICs doesn’t match nicely for reliability causes except exterior laser sources (ELS) are used which will increase complexity and value.

Avicena’s LightBundle™ hyperlinks use densely packed arrays of GaN microLEDs to create extremely parallel optical interconnects with typical throughputs of > 1Tb/s at energies of

The parallel nature of LightBundle™ is nicely matched to parallel chiplet interfaces like UCIe, OpenHBI, and BoW, and will also be used to increase the attain of compute interconnects like PCIe/CXL, HBM/DDR/GDDR reminiscence hyperlinks, in addition to varied inter-processor interconnects like NVLink with low energy and low latency.

Avicena at OFC 2023:
Avicena can be exhibiting the LightBundle™ structure and expertise on the OFC reveals in Sales space #3950.

TrendForce 2022 Micro LED Self-Emissive Show Developments and Evaluation on Provider’s Methods

Launch date: 31 Might 2022 / 30 November 2022

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